Chip-Level 1 $ imes$ 2 Optical Interconnects Using Polymer Vertical Splitter on Silicon Substrate
The chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated.The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon 45 ° reflectors.The high-frequency transmission lines combined with Face Masks the indium s